From where do the gentleman's statement gain their credibility. Site your sources, please. We are having an argument on the internet folks, the consequences are dire.
This is Saturday night and this is staring to remind me of Monday morning meetings.
Have an nice weekend.
Metal whiskering is a phenomenon that occurs in electrical devices when metals form long whisker-like projections over time.
That's what the article says. EM is a subset of metal whiskering. It's not a similar thing, it's an example of it.
You got a degree in semi conductor physics? Lol
Like i told the other guy, you're being pedantic. Engineers will call all these things whiskers. And I just mentioned I deal with one of them in my work. I'm not saying the photo in the thumbnail is an example of electromigration.
You're misunderstanding me.
For instance, electrons always move the same speed in a given metal. Which of couse isn't even 'true' because temperature affects mobility.
There are multiple mechanisms for metal to migrate, grow whiskers, or whatever you like to call the individual growth on an object. I mentioned that in the case if ICs, we are concerned with one we call electromigration. I'm not saying all metal migration is due to electromigration.
You're being pedantic when all I'm saying is, I deal with these sorts of concerns in my job.
Well that makes sense lol. Right over my head.
Really? Why? Too much radio play in the 90s?
Electromigration in ICs typically occurs in metal interconnect, so there are no dopants there to move. Dopants are added to the silicon substrate.
This is like saying an SUV isn't a car.
OP: Look at my car
Me: I have one too. It's an SUV
You: SUV's aren't cars.
The mechanism behind metal whisker growth is not well understood, but seems to be encouraged by compressive mechanical stresses. According to Wikipedia.
Electrons in metal always move the same speed, and potential differences in modern high perf applications are never above 3.3V. There are mechanical stresses in ICs introduced during manufacturing. So these cases aren't as different as you let on.
Anyway, point is, metal moves, we have some ideas why and can model some of them. From an engineering perspective these are both tin whiskers. We call whiskers made of copper and aluminum tin whiskers. You're describing a distinction without a difference.
This can happen inside ICs and has been a known failure mode for high frequency processors for many years. I work in chip design, and we use software tools to simulate it. It's called electromigration.
One of many shrines to our capitalist overlords and the mighty dollar.
All cultures use pyramids to show the reverence due to their gods, right?
900 pages... I mean, that's a lot for a poorly run project...